Stress migration

Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance. Stress Migration is often referred as Stress Voiding, Stress Induced Voiding or SIV.

单词	Stress migration
释义	Stress migration 英语百科 Stress migration Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance. Stress Migration is often referred as Stress Voiding, Stress Induced Voiding or SIV.
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