三维芯片 Three-dimensional integrated circuit
（重定向自Three Dimensional Integrated Circuit）
3D IC是将多颗芯片进行三维空间垂直集成，以因应半导体制程受到电子及材料的物理极限。 半导体行业追求这个有前途的技术，在许多不同的形式，但它尚未被广泛使用，因此，定义还是有点不固定。
| 单词 | Three Dimensional Integrated Circuit |
| 释义 |
Three Dimensional Integrated Circuit
中文百科
三维芯片 Three-dimensional integrated circuit（重定向自Three Dimensional Integrated Circuit）
3D IC是将多颗芯片进行三维空间垂直集成，以因应半导体制程受到电子及材料的物理极限。 半导体行业追求这个有前途的技术，在许多不同的形式，但它尚未被广泛使用，因此，定义还是有点不固定。
英语百科
Three-dimensional integrated circuit 三维晶片（重定向自Three Dimensional Integrated Circuit）
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits. They can be classified by their level of interconnect hierarchy at the global (package), intermediate (bond pad) and local (transistor) level In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs), monolithic 3D ICs; 3D heterogeneous integration; and 3D systems integration. International organizations such as the Jisso Technology Roadmap Committee (JIC) and the International Technology Roadmap for Semiconductors (ITRS) have worked to classify the various 3D integration technologies to further the establishment of standards and roadmaps of 3D integration. |
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