| 单词 |
wafer bonding technology |
| 释义 |
wafer bonding technology
- 耦合力ǒu hé lì
bonding force
- 圣饼shèng bǐng
wafer
- 圆片yuán piàn
wafer
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 建筑技术jiàn zhù jì shù
building technology; architectural technology; construction technology
- 干胶片gàn jiāo piàn
wafer
- 缝焊féng hàn
slit bonding
- 创新科技chuàng xīn kē jì
creative technology; innovative technology
- 领先技术lǐng xiān jì shù
lead-edge technologies; leading technologies
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 技术贸易jì shù mào yì
trade in technology; technology transference
- 晶片jīng piàn
chip; crystal plate; wafer
- 芯片xīn piàn
slug; chip; die; wafer
- 计算机应用技术jì suàn jī yīng yòng jì shù
CAT(computer application technology)
- 极薄jí báo
as thin as a wafer
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 科技与社会kē jì yǔ shè huì
STS(science,technology and society); technology and society
- 汉字信息处理技术hàn zì xìn xī chù lǐ jì shù
technology of Chinese information processing
- 引进技术yǐn jìn jì shù
introduction of technology; introduced technology; import of foreign talents
- 工业技术gōng yè jì shù
technology
- 科技kē jì
science and technology
- 科学技术kē xué jì shù
technology
- 硬技术yìng jì shù
hard technology
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