| 释义 |
copper wafer bonding
- 耦合力ǒu hé lì
bonding force
- 镀铜dù tóng
coppering; copperize; copper plating; cuprodine
- 圣饼shèng bǐng
wafer
- 圆片yuán piàn
wafer
- 铜矿tóng kuàng
copper mine; copper ore
- 铜线tóng xiàn
copper line; copper wire
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 干胶片gàn jiāo piàn
wafer
- 缝焊féng hàn
slit bonding
- 铜包钢线tóng bāo gāng xiàn
copper covered steel conductor; copper clad steel conductor; copper weld wire
- 铜tóng
copper (Cu)
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 晶片jīng piàn
chip; crystal plate; wafer
- 芯片xīn piàn
slug; chip; die; wafer
- 纯铜chún tóng
fine copper
- 碲铜dì tóng
tellurium copper
- 铍铜pí tóng
BeCu(beryllium copper)
- 铜包皮tóng bāo pí
coppering
- 铜箔tóng bó
copper foil
- 铜管tóng guǎn
copper pipe
- 铜片tóng piàn
sheet copper
- 铜钱tóng qián
copper cash
- 铸铜zhù tóng
cast copper
- 励磁绕组lì cí rào zǔ
field copper; exciting winding; field winding; magnet winding
|