物理气相沉积（英语：Physical vapor deposition，PVD）是一种工业制造上的工艺，是主要利用物理过程来沉积薄膜的技术，即真空镀膜（蒸镀），多用在钣金件、蚀刻件、挤压件、金属射出成型（MIM）、粉末射出成型（PIM）、机加件和焊接件等零件的工艺上。

和化学气相沉积相比，物理气相沉积适用范围广泛，几乎所有材料的薄膜都可以用物理气相沉积来制备，但是薄膜厚度的均匀性是物理气相沉积中的一个问题。

主要的物理气相沉积的方法有：

Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films. PVD uses physical process (such as heating or sputtering) to produce a vapor of material, which is then deposited on the object which requires coating. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. Examples include semiconductor devices such as thin film solar panels, aluminized PET film for food packaging and balloons, and coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools (mainly for scientific purposes) have been developed.